CVE & CISA-KEV Catalog

CVE-2023-33063

HIGHCISA KEV
7.8
CVSS v3
NVD

Description

Memory corruption in DSP Services during a remote call from HLOS to DSP.

CVSS v3 Vector

Exploitability

Attack VectorLocal
Attack ComplexityLow
Privileges RequiredLow
User InteractionNone
ScopeUnchanged

Impact

ConfidentialityHigh
IntegrityHigh
AvailabilityHigh

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Exploit Intelligence

0.70%probability of exploitation in 30 days
48thpercentile

Moderate risk: more likely to be exploited than 48% of all known CVEs.

Known Exploited Vulnerability (CISA KEV)

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Remediation due: 2023-12-26

References

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This product uses NVD data but is not endorsed or certified by the NVD. EPSS scores courtesy of FIRST.org (https://www.first.org/epss). Source: CISA KEV Catalog. Data as of 2025-10-27.