CVE & CISA-KEV Catalog

CVE-2022-22071

HIGHCISA KEV
8.4
CVSS v3
NVD

Description

Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music

CVSS v3 Vector

Exploitability

Attack VectorLocal
Attack ComplexityLow
Privileges RequiredNone
User InteractionNone
ScopeUnchanged

Impact

ConfidentialityHigh
IntegrityHigh
AvailabilityHigh

CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Exploit Intelligence

0.45%probability of exploitation in 30 days
36thpercentile

Low risk: more likely to be exploited than 36% of all known CVEs.

Known Exploited Vulnerability (CISA KEV)

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Remediation due: 2023-12-26

References

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This product uses NVD data but is not endorsed or certified by the NVD. EPSS scores courtesy of FIRST.org (https://www.first.org/epss). Source: CISA KEV Catalog. Data as of 2025-10-28.