CVE-2022-22071
HIGHCISA KEVDescription
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
CVSS v3 Vector
Exploitability
Impact
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Exploit Intelligence
Low risk: more likely to be exploited than 36% of all known CVEs.
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Remediation due: 2023-12-26
References
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Start freeThis product uses NVD data but is not endorsed or certified by the NVD. EPSS scores courtesy of FIRST.org (https://www.first.org/epss). Source: CISA KEV Catalog. Data as of 2025-10-28.